3mo ago

TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models

4 comments

I wonder what the end game is now that we are stacking chiplets onto substrates to build processors. Chips with heat pipes and power delivery integrated within the layers?
- TSMC is working on channels for liquid cooling build into chips, so we'll probably submerge future ones
lmao, sorry but I can't help myself, this feels like taiwan's baiting USA like: "hey US, I bet your greedy fucks over there wants this, it'll be such a shame if you wont ACT NOW and all of this goes to waste dont cha think?"
also don't get me wrong due to this might be taken out of context, I wont side to US or china or any dbag nations because they're all ehh.......
NVIDIA is pretty much doing the same thing. Blackwell dies are colossal and getting bigger.